TECHNOLOGY CAPABILITIES

Current Technology Capability and Future Development

Process Capability

Feature(all dim. in mm) Current Process Capability
Standard Advanced*
Max. Layer Count 2-10 12-16
Min. Drill Size (PTH) 0.30 mm 0.25 mm
Min. Finished hole 0.25 mm 0.20 mm
Diameter plated hole tolerane +/-0.08 mm +/-0.05 mm
Diameter non plated hole tolerane +/-0.05 mm +/- 0.03 mm
Diameter press fit hole tolerance +0.09/-0.06 mm +/- 0.04 mm
Positioning hole tolerance +/-0.08 mm +/-0.05 mm
Max. Aspect ratio (Base on finished hole) 7:1 8:1
Min. Board thickness 0.80 mm 0.40 mm
Max. Board thickness 2.40 mm 3.20 mm
Finished board thickness tolerance +/-10% -
Min. Core thickness 0.075 mm 0.063 mm
Min. Prepreg thickness 0.075 mm 0.063 mm
Min. Copper foil thickness 0.5 oz 0.33 oz
Max. Copper foil thickness 3 oz 4 oz
Min. Inner layer Line / Space 0.10/0.10 mm 0.075/0.075 mm
Min. Outer layer Line & Space 0.10/0.10 mm 0.075/0.075 mm
Pattern registration tolerance +/-0.075 mm +/-0.05 mm
Min. Pad size over drill Drill + 0.25 mm Drill + 0.20 mm
Min. Solder mask clearance 0.08 mm 0.05 mm
Min. Solder mask web between pads 0.08 mm -
Min. Soldermask registration tolerance +/-0.08 mm +/-0.05 mm
Max. plugged hole diameter 0.40 mm 0.50 mm
Min. Legend width 0.20 mm 0.15 mm
Min. Size of carbon pad Cu pad + 0.40 mm Cu pad + 0.30 mm
Min. Spacing between carbon pads 0.40 mm 0.30 mm
Routing dimension tolerance +/-0.13 mm +/-0.10 mm
Punching dimesion tolerance +/-0.15 mm +/-0.13 mm
Scoring angle 30, 60 degree 90 degree
Scoring web thickness tolerance +/-0.13 mm +/0.10 mm
Beveling angle 20, 30, 45 degree -
Warp and Twist 0.7% 0.5%
Impedance Single ended tolerance +/-10% +/-7%
Impedance Differential tolerance +/-10% +/-7%
Impedance Coplanar Tolerance +/-10% +/-7%
Min. Nickel thickness 2.50 uM 4.0 uM
Hard gold plated thickness 0.20-0.76 uM 0.76-1.0 uM
Min. Immersion gold thickness 0.05 uM 0.08 uM
Min. Immersion Tin thickness 0.8 uM 1.0 uM
Min. Immersion Silver thickness 0.2-0.4 uM -
OSP (Entek HT) thickness 0.2-0.5 uM -
Lead Free HASL thickness 1-25 uM -
HASL thickness 1-25 uM -

Heigh Density Interconnect (HDI)

.
Feature(all dim. in mm) Current Process Capability
Standard Advanced*
Blind Via size (Laser drill) 0.10-0.20 mm -
Min. Target / Capture Pad diameter for laser blind via Drill + 0.25 mm Drill + 0.20 mm
Max. Laser blind via depth 0.075 mm 0.115 mm
Max. Aspect Ratio (Base on laser drill size) 0.6:1 0.7:1
Sequential Lamination 0.6:1 0.7:1
Sequential Lamination - Yes
HDI Type Construction Type I, Type II Type III, Stack via, Stragger via
Build Up Layers 1-N-1, 2-N-2 3-N-3
Copper Fill Plating for laser blind via Yes -
Max. Dimple for Cu fill in laser blind via 30 uM 20 uM
Min. Pad size over mechnical buried via Drill + 0.25 mm Drill + 0.20 mm
Finished hole size for Via in Pad Technology / Plated over filled via (POFV) 0.30 mm 0.25 mm
Min. Pad size over drill for via in pad technology Drill + 0.30 mm Drill + 0.25 mm

Materials and Surace Finishes

Feature Current Process Capability
Standard Advanced*
FR-4 (Lead Free material) Tg 140, 150,170 'C Tg 180 'C
FR-4 (Halogen Free material) Tg 150 'C Tg 170 'C
CAF Resistant Laminate YES -
Solder mask Printing Taiyo PSR-4000 (matte, glossy), Probimer 77 (semi-matte) -
Solder mask color Green Blue, White
Via Plugging solder mask Taiyo and Peter -
Legend color White / Yellow -
Peelable mask on board Peter SD2954, Blue color -
Carbon Ink Tamura MRX-713J -
Kapton tape YES -

Special Process Offerings

Feature Current Process Capability
Standard Advanced*
External Heat Sink on PCB YES -
Outside Semi-Flex PCB 1 Cu layer bendable 2 Cu layer bendable
Middle Semi-Flex PCB - 2 Cu layer bendable
Bending Ability (Semi-flex PCB) 90 degree 180 degree
Total flex thickness 0.20-0.50 mm 0.15-0.30 mm
Depth routing tolerance +/- 0.15 mm +/- 0.10 mm
  • * NOTE
  • 1. Advanced Process Capability requires additional process steps and/or special materials / processing.
  • 2. Advanced Process Capability will have limitied production output and cost adders.
  • 3. Orders deemed to fall under the advanced capability will be managed by the NPI Engineering Team
Top